Seiko Instruments Components on ICGOODFIND SiteMap
最新文章
- Yongxi Electronics Drops $1.4B on Advanced Packaging – Can It Survive the 8-Year Climb?
- SMIC Completes Asset Acquisition, Big Fund Becomes Third‑Largest Shareholder
- Kuaishou‑Spun Lingchuan Secures Series A+ Funding for Video AI Chip Expansion
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Japan Pours Another ¥150B into Rapidus as 2nm Fab Push Intensifies
- Qualcomm in Talks to Buy AI Chip Firm Modular for $4B
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- Xnergy’s 3300V SiC MOSFET Cuts Solid‑State Transformer Cost by Up to 35%
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- STMicroelectronics Issues $1.5B Convertible Notes to Refinance Debt
- Marvell Unveils Optical Interconnect for Cross‑Region AI Compute – Ara 1.6T and Teralynx T100 Switch
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- AMD Sweeps Amazon US CPU Best‑Seller List – Top 15 All AMD, Zero Intel
- China Big Fund Exits MEMS Fab Silex Beijing – Silex Micro to Take Full Ownership
- Unigroup Guoxin Completes IPO Coaching, Moves Closer to STAR Market Listing
- Google Orders >3 Million Intel‑Made TPUs, Intel Stock Jumps 13%
- Microchip Launches dsPIC33CK Value DSC – Low‑Cost, High‑Performance Real‑Time Control
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- PRINANO’s Vacuum Nanoimprint PL‑AS Mass‑Produces 8‑Inch Optical Chips at 1/10 DUV Cost
- WSTS Raises 2026 Semiconductor Forecast to $1.51T, Memory up 250%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Quantinuum Upsized IPO to $1.46B, Valuation Hits $14.3B on Strong Demand
- The NXP BLF8G20LS-230V is a high-performance LDMOS (Laterally Diffused Metal Oxide Semiconductor) power transistor engineered specifically for industrial, scientific, and medical (ISM) applications, a
- NXP BGY835C: A High-Performance 25-1218 MHz CATV Line Amplifier for Next-Generation Network Infrastructure
- NXP BUK7Y21-40EX: A High-Performance 40V MOSFET for Advanced Automotive and Industrial Applications
- Intel Debuts 18A Xeon 6+, E835 Ethernet, and Xe3P GPU at Taipei Show
- NXP BTA316-600D: A Comprehensive Technical Overview of the 600V High-Side Intelligent Power Switch
- NXP BT148-400R: A Comprehensive Technical Overview of the 400V, 1A NPN Silicon Transistor
- NXP BLF8G10LS-160: A High-Performance LDMOS Transistor for UHF Broadcast and Industrial Applications
- NXP BGY292E/03/N1: A High-Performance Wi-Fi 6 Front-End Module for Next-Generation Applications
- NXP BLF8G10LS-300PJ: A High-Performance LDMOS Transistor for UHF and ISM Band RF Applications
- Maxio’s First UFS 3.1 Controller Ships to Major China Customers, PCIe 5.0 Enterprise SSD Controller in Test
- TrendForce Raises 2027 Memory Market Forecast to $1.28T, Driven by Agentic AI
- Loongson Plans $317M Private Placement, LoongArch CPU Shipments Top 1 Million
- Kioxia Delays BiCS10 3D NAND Mass Production to 2027, Boosts Density 59%
- NXP 74HCT259D: A Comprehensive Guide to the 8-Bit Addressable Latch/3-to-8 Decoder
- NXP UJA1169TK/3: A Comprehensive Technical Overview of its Features and Applications
- NXP CX24113A-12Z: A Comprehensive Technical Overview of the Advanced Satellite Receiver Demodulator
- NXP BCP69: A Comprehensive Guide to the PNP/NPN Digital Transistor for Load Switching
- NXP BZX585-B6V2: A Comprehensive Technical Overview of the 2V Precision Zener Diode
- NXP TDA8023TT: A Comprehensive Technical Overview of Philips' Secure Smart Card Interface IC
- NXP CBT3257APW: A High-Performance Dual 1-of-4 FET Multiplexer/Demultiplexer
- NXP 74HC30PW: A Comprehensive Technical Overview of the 8-Input NAND Gate IC
- Panasonic, Kemet Raise Capacitor Prices Up to 65% as AI Server Demand Tightens Supply
- Russia Turns to Chinese AI Chips for GigaChat as Western Sanctions Bite
- Ex-Samsung Exec Predicts Memory Chip Prices to Drop in H2 2027 as China Ramps Capacity
- Anlogic Launches ELF5 and Phoenix 1P FPGAs, Shifts from Local Substitute to Industry Leader
- Xiaomi Confirms New Xuanjie Chip in 2026, First Gen Surpassed 1M Shipments
- PSMN063-150D: NXP's Benchmark 150A, 60V MOSFET for High-Performance Power Conversion
- The PCF8574P Remote 8-Bit I/O Expander for I2C Bus from NXP Semiconductors
- NXP 74LVCH244APW: 3V Octal Buffer/Line Driver with 5V Tolerant Inputs/Outputs and Tri-State Outputs
- Apple Taps Intel’s 18A-P for A/M Series Chips, Ending TSMC’s Exclusive Grip
- NXP HEF4071BP Quad 2-Input OR Gate: Datasheet, Pinout, and Application Circuit Guide
- NXP 74LVC573APW: A Comprehensive Technical Overview of the Octal D-Type Latch with 3-State Outputs
- NXP PMBS3904: A Comprehensive Technical Overview of the General-Purpose NPN Bipolar Junction Transistor
- NXP BZX84-C13: A Comprehensive Technical Overview of the 13V Zener Diode
- NXP 1PS79SB31: A Comprehensive Analysis of its Key Features and Target Applications
- Microchip Launches LAN878x/LAN888x Single-Pair Ethernet PHYs with MACsec for Automotive and Industrial Use
- SG Micro Launches SGM51633S2: 16-Bit SAR ADC with 333ns Delay and 93dB SNR
- indie Semiconductor Buys ams OSRAM’s CIS Business for €40M
- NXP MKV42F128VLF16: A Comprehensive Technical Overview of Kinetis K42 MCU Features and Applications
- NXP PN7362BNHN/C300Y: A Comprehensive Technical Overview of the High-Performance NFC Controller
- PCF7900NHN/C0K/U: NXP's Advanced Secure Transponder for Next-Generation Automotive Immobilizer Systems
- NXP PMV48XPA: A High-Performance P-Channel TrenchMOS Transistor for Power Management Applications
- NXP PMZ600UNE: A High-Performance, Low-Voltage Dual NPN/NPN Transistor Array for Space-Constrained Designs
- NXP QN9083DUK: A Comprehensive Overview of its Ultra-Low-Power Bluetooth 0 SoC Architecture and Target Applications
- MRFX035HR5: The High-Power RF LDMOS Transistor for Next-Generation Broadcast and Industrial Applications
- NXP MPX2202DP: A Comprehensive Technical Overview of its Differential Pressure Sensing Capabilities and Applications
- Global Semiconductor Packaging Market to Hit $618.9B, Fueled by AI and EVs
- World’s Largest MEMS Foundry Silex Lists on Nasdaq Stockholm
- Arm Q4 Revenue Hits $1.49B Record – AI Drives Royalty Surge
- AMD Q1 Net Profit Jumps 95% – Samsung Breaks $1 Trillion Market Cap
- The NXP FS32K146UAT0VLL is a high-performance, automotive-grade 32-bit microcontroller based on the Arm® Cortex®-M4F core. It is a pivotal component of NXP's S32K1xx family, specifically designed
- NXP LPC5516JBD64: A High-Performance, Secure Arm Cortex-M33 Microcontroller for Embedded Applications
- NXP TEF6617T/V1/S422: A Comprehensive Technical Overview of its Architecture and Automotive Applications
- NXP S9S12VR48AF0VLCR: A Comprehensive Technical Overview of the 16-bit HCS12VR Microcontroller for Automotive Body Control Applications
- The NXP MKV58F1M0VLQ24: A High-Performance Cortex-M7 Microcontroller for Automotive and Industrial Applications
- NXP BSS138BKW: A Comprehensive Technical Overview of the Low-Voltage Single N-Channel MOSFET
- NXP BFR93AW Silicon RF Transistor: Key Features, Applications, and Design Considerations
- NXP MPX5100GP: A Comprehensive Technical Overview of a 0 to 100 kPa Integrated Pressure Sensor
- Renesas Q1 Operating Profit Soars 49.6% – Data Center & Auto Drive Beat
- NXP BZX384-C5V1: A Comprehensive Technical Overview of the 1V Precision Zener Diode
- NXP LPC1778FBD144: A Comprehensive Technical Overview of the ARM Cortex-M3 Microcontroller
- NXP MMPF0100F4AEP: A Comprehensive Technical Overview of the Programmable Power Management IC
- NXP PCA9532PW: A Comprehensive Guide to the I²C-Bus 16-Bit LED Controller
- NXP SA602AD/01: A Comprehensive Technical Overview of the Monolithic Double-Balanced Mixer and Oscillator IC
- Parallel-In/Serial-Out: Interfacing the 74HC165D Shift Register with Microcontrollers
- NXP MPXAZ6115AP: A Comprehensive Technical Overview of its Absolute Pressure Sensing Capabilities
- NXP AU5790D: A High-Performance Bidirectional DC Circuit Breaker for 48V Automotive Systems
- Xiaomi XRING O3 Chip Leak – 4GHz+ Prime Core and Full Architecture Overhaul
- Tokyo Electron Cuts Ties with China Chief Over Secret Startup Ties
- Bosch Launches 3rd‑Gen SiC Chip – 20% Performance Leap for EVs
- Japan 7.7 Magnitude Earthquake Hits Semiconductor Hub – Kioxia & Tokyo Electron Report No Damage
- Diodes AL8859Q – Automotive SPI Boost Controller for Headlight Systems
- UMC and eMemory Restart Memory Foundry in Japan – 2D NAND & NOR Flash
- Huawei Launches Kirin 9030S with 200% AI Performance Surge – Pura 90 Series First
- Chinese Semi Equipment Leader ACM Research Plans Hong Kong Listing
- Yuanjie Technology Tops 1,410 Yuan, Dethrones Moutai as A-Share “Stock King”
- ASE Invests $443M to Acquire Innolux Fab – Advanced Packaging Capacity Surges